Laminovaci fotorezist, predloha

[Petr Labaj]

Ano, urcite by to slo i pres tu folii. Ale prece jen je pak motiv kousek nad
tistakem a je to potencialni zdroj podsviceni okraju. Navic s tou folii
(kterou sundavam bezprostredne pred prilozenim motivu) sundam
i pripadny prach a necistoty.
Zlepseni vysledku potvrzovaly i nejake nazory  lidi, co s tim dlouho
delaji. Ja sam to porovnat nemuzu, od zacatku to sundavam.

PL

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From: "Milan B." <milan na bastl.sk>

A preto sa ta vrchna folia (ta tensia a priezracnejsia, ak su rozne na 
oboch stranach) pocas expozicie ponechava a odstranuje sa az pred 
vyvolavanim.

Napriklad na 
http://www.frezycnc.eu/pcb-processing-manual/photoresist-and-soldermask/lamination/ 
pisu:
*Cover sheet*: The outer covering of the multilayered film is usually 
made of heat resistant polyester (PET, a.k.a. Mylar). Since it functions 
as an oxygen block (see below) as well as a protective layer, it should 
remain in place on the outer layer of the resist until the board is 
ready to be developed. The cover sheet should be left in place at least 
15 minutes after exposure and should only be removed imediately prior to 
developing.

Alebo v 
http://www.megauk.com/datasheets/5180_Data_Sheet_How_to_Laminate_Dry_Film_Photoresist%280210%29.pdf 
pisu:
3. When exposure is complete, remove the plate which will show all 
exposed areas as Blue
against a Green background.
4. Remove the top protective film and place the plate in the Developer tank,

-m-