Moisture sensitive devices

[balu@home]

to je dalsia z vyhod bezolovnatej technologie :-) Puzdra sa musia pred 
osadzovanim vypekat, inak hrozi ze popraskaju... Na domace pouzitie je 
to myslim jedno, zapajkuje sa to rucne. Pre seriovu vyrobu s 
pretavovanim v peci to ale je problem, suciastky sa musia vzdy pred 
pajkovanim vysusit v peci.

vynatok z clanku 
http://www.assemblymag.com/Articles/Feature_Article/c8c111024f64a010VgnVCM100000f932a8c0____

During solder reflow, the combination of rapid moisture expansion and 
material mismatch can result in package cracking or delamination of 
critical interfaces within the package. Unfortunately, these internal 
defects are nearly impossible to detect during the PCB assembly and test 
process. They lead to a number of failure modes that have a negative 
impact on manufacturing yield and cause early failure of electronic 
products, such as cameras, cell phones and computers.

takze mam pocit ze dalsi bod v technikach "Planned obsolescence"
b.




Jan Smrz wrote:
> Zdravim,
>
>    objednal jsem si nejake obvody od Farnellu a prisly ve vakuovem
> baleni s varovanim "Moisture sensitive device, 168h". Priznam se, ze
> jsem se s timto setkal poprve a tak nemam s takto nachylnymi obvody
> zkusenosti.
>
>    Protoze vsechny IC prisly v jednom baleni a ja jich momentalne
> potrebuji jen par, tak by mne zajimalo, jak ty zbyvajici "zakonzervovat"
> na pozdejsi pouziti. Vakuove si to doma nezabalim. Staci mit je v
> pytliku se silika-gelem?
>
>    Dekuji,
>
>    J.S.
>