Laminovaci fotorezist, predloha

[Milan B.]

On 1.10.2011 22:02, Petr Labaj wrote:
> To, ze toner drzi dobre je pro negativni resist podle me dost podstatne,
> protoze ten resist je takovy lehce lepivy a ma tendenci strhavat toner
> z predlohy.
A preto sa ta vrchna folia (ta tensia a priezracnejsia, ak su rozne na 
oboch stranach) pocas expozicie ponechava a odstranuje sa az pred 
vyvolavanim.

Napriklad na 
http://www.frezycnc.eu/pcb-processing-manual/photoresist-and-soldermask/lamination/ 
pisu:
*Cover sheet*: The outer covering of the multilayered film is usually 
made of heat resistant polyester (PET, a.k.a. Mylar). Since it functions 
as an oxygen block (see below) as well as a protective layer, it should 
remain in place on the outer layer of the resist until the board is 
ready to be developed. The cover sheet should be left in place at least 
15 minutes after exposure and should only be removed imediately prior to 
developing.

Alebo v 
http://www.megauk.com/datasheets/5180_Data_Sheet_How_to_Laminate_Dry_Film_Photoresist%280210%29.pdf 
pisu:
3. When exposure is complete, remove the plate which will show all 
exposed areas as Blue
against a Green background.
4. Remove the top protective film and place the plate in the Developer tank,

-m-

>   Tahle folie po 10 aplikacich na negativnim resistu je stale zdanlive
> beze zmeny (vic jsem zatim z jedne predlohu na neg. resistu nedelal).
>
> Postscript je super, proto pri vyberu tiskarny byly me zakladni pozadovane
> pozadavky aby umela Postscript a mela nativni rozliseni 1200x1200 dpi.
>
> Petr Labaj
>
> ******************************
>
> From: "Jaroslav Buchta"<jaroslav.buchta na hascomp.cz>
>
>
> Tak IMHO digitalni cesta pres postscript je lepsi (asi jediny format,
> ktery umi KiCad negativne) a pri tisku pak rozmer sedi, v tom problem
> neni... Folie bych zkusil ale kde je sehnat opravdu netusim.
>
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